TSMC Lays Down Roadmap For Its 2nm Chips; Will Enter Mass Production In 2025

With TSMC’s 3nm Process to Enter Mass Production in Q3 of 2022, TSMC Has Already Laid Down The Path to Its 2nm Process.
TSMC 2nm Chips Roadmap

With TSMC all set to start mass-producing its 3nm chips sometime in Q1 of 2023, TSMC has already revealed the future roadmap for its next-generation 2nm chips at its first-quarter earnings call of 2022. The new chips are also expected to feature a new transistor design.

According to a statement made by TSMC’s CEO C.C. Wei, the next generation of chip fabrication process will continue to rely on ASML’s existing extreme ultraviolet (EUV) lithography machines, with a very high NA (numerical aperture) of 0.33.

ASML EUV Lithography Machine Used by TSMC
ASML EUV Lithography Machine (Source: ASML)

Furthermore, he added, the new process will be ready for risk/test production sometime in Q4 of 2024 and is scheduled to begin high-volume manufacturing (HVM) toward the end of 2025. Thus, suggesting that TSMC’s first 2nm customer (likely Apple) should receive its first N2-based chips sometime in 2026.

Technically speaking, TSMC’s N2 process is also set to transition from using older FinFET (fin field-effect transistors) in favour of GAA (gate-all-around) transistor technology. The same transistor tech has already been improved upon by Samsung with the introduction of its proprietary MBCFET (Multi-bridge channel FET) design that’s expected to make its way to the upcoming 3nm chips that will hit the markets soon.

Samsung 3nm Transistor Design
Different Types of Transistor Designs (Source: Samsung)

That being said, apart from giving us a look at the future roadmap of TSMC’s next-gen 2nm fabrication process, this report also shows how difficult it is to produce more advance and smaller chips as we are nearing the 1nm mark. Previously TSMC used to kick off production using its brand-new nodes every two years. This is not the case with its 2nm process, as it’s expected to enter HVM (High Volume Manufacturing) phase almost four years after its 3nm process entered the HVM phase.

Whatever the case may be, we can’t wait to see what performance and power consumption benifits the next-gen 2nm chips will bring when they finally hit the markets sometime in 2026.

Also Read: Apple is Reportedly Testing At least Nine New Macs With Four Different M2 Chips

Are you excited about TSMC’s next-gen N2 (2nm) process and what it holds for the semiconductor industry as a whole? Let us know in the comment section below. Until then, join us on Telegram, Facebook, or Twitter to stay up to date with the latest happenings in the tech industry.

Total
0
Shares
Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Related Posts