Home Mobile Phones Samsung Releases a New Generation of 5G RAN Equipment Chip Products

Samsung Releases a New Generation of 5G RAN Equipment Chip Products

It will improve the performance and energy efficiency of 5G products and will be put into commercial use next year.

Samsung has unveiled a wide range of chipsets that will be embedded into smartphones. The company introduced a new 3GPP Rel.16 compliant chipset that consists of a third-gen mmWave Radio Frequency Integrated Circuit (RFIC) chip, a Digital Front End (DFE)-RFIC integrated chip, and a second-gen 5G modern SoC. These chips will power Samsung’s upcoming 5G smartphones, which are expected to hit the market in 2022. The new chipsets were announced on June 22, 2021.

Samsung held a virtual public event “Samsung Network: Redefined”, highlighting solutions for network transformation and their notable accomplishments in the 5G network. At the event, Samsung pointed out their development and the experience in developing the in-house chipsets for more than twenty years and their investments behind the launch of multiple generations of chipsets starting from 3G, leading to today’s cutting-edge 5G solutions.

“5G chipsets are critical to achieving the performance capabilities required for next-generation network deployments”

The upcoming chipsets are designed to take the lineup of 5G smartphones to another level, increasing power efficiency, boosting performance, and significantly reducing the size of 5G solutions.

Samsung’s newly-introduced chips are:

  • 3rd Generation mmWave RFIC
  • 2nd Generation 5G Modem SoC
  • DFE-RFIC Integrated chip

Samsung Networks has achieved the successful delivery of a 5G end-to-end solution for chipsets, radios, and core. This also includes the manufacturing and shipment of chips from Autin, Texas. Samsung leads the 5G network industry with its market-leading product portfolio, providing network solutions to mobile operators that deliver connectivity to hundreds of millions of users around the world.

On a seperate note, Samsung recently exhibited a 6G Terahertz (THz) wireless communication prototype (UCSB) in partnership with the University of California, Santa Barbara. The experiment looked into the possibility of using THz spectrum for 6G wireless connectivity.

Working together with UCSB, we have been able to overcome many technological challenges and develop this new THz proof-of-concept system to explore 6G use cases and deployment scenarios. Samsung and UCSB researchers will continue to push the technological boundaries to bring 6G and THz communication closer to reality.

Charlie Zhang, Senior Vice President, Samsung Research America

What do you think about Samsungs new chipsets? Let us know in the comment section underneath. Stay tuned to our page by subscribing to our newsletter down below, and don’t forget to join our telegram channel for regular news and updates.

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Ashvin Chavda
Ashvin is a true master of the art of being a handful, Handling in-house operations, instructional designing, being a part-time writer, and acting as the company's mascot. He is the Rico of the team from Madagascar. Everyone calls him crazy! But he prefers the term mentally hilarious.
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