Redmi K50 flagship series is scheduled to launch in China on March 17. As we are getting near to the launch date, the brand is highlighting more details about – A general trend that we see with most of the smartphone launches. The latest teases about the Redmi K50 series reveals its design from both front and rear side, and reveal some key specifications.
The brand is expected to unveil Redmi K50, K50 Pro, and K50 Pro+ at the upcoming launch event. New Teasers have confirmed that the devices will feature a centred punch-hole cutout for the selfie camera. Redmi has already confirmed the 108MP camera on K50 Pro and K50 Pro+. But, the K50 Pro will miss out on OIS support.
Redmi K50 series will be the first set of smartphones to support Bluetooth v5.3 – the latest generation of Bluetooth technology. The brand claims the latest Bluetooth generation to offer lower latency for a better gaming experience and lower power consumption. The K50 series has been confirmed to support L3C audio coding, dual-frequency GPS, NFC, IR blaster, and X-axis motor.
The upcoming Redmi K50 Pro will feature the Dimensity 8100 chipset as the world’s first phone to launch with this chipset. The top-end Redmi K50 Pro+ is confirmed to pack the powerful Dimensity 9000 SoC. The Redmi K50 Pro+ has pulled off over a million points on the AnTuTu benchmark, which is really impressive. Redmi K50 trio are said to run on MIUI 13, based on Android 12.
While the company has not talked much about the standard Redmi K50, recent leaks While the company has not talked much about the standard Redmi K50, recent leaks suggest that it could feature Snapdragon 870 SoC, a 120Hz AMOLED screen, and a 4,700mAh battery.
Are you excited for the Redmi K50 series? What’s your expectations with the upcoming flagship series from Redmi? Do let us know your thoughts in the comments below.