Taiwanese chipmaker MediaTek is giving tough competition to chipset giant Qualcomm in each category. Whether it is a budget phone, mid-range, or even a premium phone, you will find MediaTek chipsets everywhere. And earlier today, the company added two more mid-range SoCs to its arsenal – the MediaTek Dimensity 810 and the MediaTek Dimensity 920.
MediaTek is targeting the mid-range 5G smartphone segment with the newly-introduced Dimensity 810 and Dismensity 920 SoCs. Both the chipsets have integrated 5G modems. MediaTek’s Dimensity lineup is a cost-effective solution for smartphone makers and these new chipsets will allow them to bring more cost-effective mid-range 5G phones into the market.
MediaTek Dimensity 920 SoC
The Dimensity 920 SoC is fabricated on a TSMC 6nm process and houses an octa-core CPU with an Arm Cortex-A78 cores clocked at up to 2.5GHz. The graphics-related tasks are handled by Arm Mali-G68, which inherits all the features from Mali-G78 and is more power-efficient. The chip offers up to 9% faster gaming performance than its predecessor, Dimensity 900 SoC.
The new chip supports FullHD+ high resolution and 120Hz refresh rate. It can automatically adjust the refresh rate based on game or system UI. Coming to the camera section, Dimensity 920 SoC supports 4K HDR video encoding, (3DNR + MFNR) noise reduction technique, 108MP main camera, and multi-camera arrays. The chip also supports LPDDR5 RAM and UFS 3.1 storage or premium LPDDR4X memory and UFS 2.2 storage.
In terms of connectivity, MediaTek Dimensity 920 chipset has support for faster 5G carrier aggregation, Dual 5G SIM support, dual VoNR (Voice over New Radio), Wi-Fi 6 with 2×2 MIMO, Bluetooth 5.2, and GNSS (L1+L2) for navigation. The chip also supports “HyperEngine 3.0” which is a call and data concurrency – It allows the phone to have an active 5G data connection on one SIM, while simultaneously accepting a call on the second SIM.
MediaTek Dimensity 810 SoC
Dimensity 810 SoC is also fabricated on TMSC’s 6nm production process. The octa-core CPU consists of 4x ARM Cortex-A76 cores clocked at up to 2.4GHz and 4x ARM Cortex-A55 cores clocked at up to 2GHz. The 8 cores are paired with Arm Mali-G57 MC2 GPU. Dimensity 810 is a modest upgrade over the Dimensity 800 and does not bring drastic improvements in performance.
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The chip supports up to 64MP single camera or dual 16MP camera sensors, (MFNR & MCTF) noise reduction technology, and AI-color & AI-bokeh enhancements. It also supports LPDDR4x RAM and UFS 2.2 storage. The Dimensity 810 SoC supports up to 2,560×1,080 pixels resolution (FullHD) and up to 120Hz refresh rate support. As for the connectivity, the new chip has support for Wi-Fi 5, GPS, Wi-Fi 5, Bluetooth v5.1, dual 5G SIM, and VoNR.
We can expect both these SoCs to make it to mid-range smartphones later this year.