5nm-based MediaTek Dimensity 7000 SoC Is Under Testing: Tipster

MediaTek Dimensity 7000 SoC

This week, MediaTek unveiled Dimensity 9000 SoC as the company’s most powerful chipset for mobile phones. It’s the world’s first chip build TSMC’s 4nm process. The chip will power high-end flagship phones. Now, leaks have started popping up on the internet claiming that the company will also bring MediaTek Dimensity 7000 SoC, based on the 5nm fabrication process.

MediaTek Dimensity 7000 SoC details
Weibo post by Digital Chat Station

The information comes straight from a reliable Chinese tipster that goes by the name Digital Chat Station. According to him, MediaTek is currently testing the Dimensity 7000 chip that will be built on a 5nm process. He claims that the chip supports 75W fast charging and built using TSMC + Arm architecure.

MediaTek Dimensity 9000 SoC vs Qualcomm Snapdragon 8 Gen 1 SoC

While the new flagship chipset, Dimensity 9000 SoC, will power high-end phones, Dimensity 7000 SoC is likely to power the mid-range category. The upcoming Dimensity 7000 SoC from MediaTek could replace its existing 6nm-based chipsets like Dimensity 1200 and Dimensity 1100. 

Dimensity 7000 SoC details leak

The naming scheme of MediaTek chipsets is quite unusual, as the Dimensity 9000 is a direct jump from the Dimensity 1200 SoC. MediaTek is already giving tough competition to chipset giant, Qualcomm. It has a great capture in the mid-range segment, and now the company seems to be going even further by targeting the flagship segment with the Dimensity 9000 SoC. The new chip from MediaTek will compete with the upcoming flagship chip from Qualcomm, reportedly called Snapdragon 8 Gen 1. Qualcomm could announce this new chip in the coming weeks. 

MediaTek Dimensity 9000 SoC vs Qualcomm Snapdragon 8 Gen 1 SoC: What to Expect?

Since Snapdragon 8 Gen 1 is not released yet, we’ll compare its leaked information with the recently-announced Dimensity 9000 SoC. The next flagship chip from Qualcomm is said to be based on a Samsung’s 4nm process, while the Dimensity 9000 SoC is based on TSMC’s 4nm solution.

In terms of CPU, both are octa-core processors. The Dimensity 9000 SoC has 1 × 3.0 GHz Cortex-X2 super-large core + 3 × 2.85 GHz Cortex-A710 large cores + 4 × 1.8 GHz Cortex-A510 power-efficient cores. On the flip side, the Snapdragon 8 Gen 1 reportedly has 1 × 3.0 GHz Cortex-X2 prime core + 3 × 2.5 GHz Cortex-A710 performance cores + 4 × 1.79 GHz Cortex-A510 power-efficient cores.

The graphics-related tasks in the Dimensity 9000 chip are handled by the Mali-G710 MC10 GPU. Whereas, the Snapdragon 8 Gen 1 is said to bring Adreno 730 GPU. We’ll have to wait and see which of these two GPUs are good at handling graphics.

Qualcomm is expected to announce its next flagship chip in early next month. We’ll then have a more detailed look at what the new chip brings.

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