[List] These Upcoming Phones From Realme, Redmi, and OnePlus Will Get Dimensity 8100 SoC

Upcoming phones with Dimensity 8100 processor

Today, MediaTek has announced the Dimensity 8000 series, which looks to be powering mid-range phones. The Taiwanese chip giant announced Dimensity 8000 and Dimensity 8100 SoCs as their latest addition to the Dimensity series. The latest Dimensity chipsets will compete with Snapdragon 870 and Snapdragon 888 SoCs from Qualcomm.

Soon after the announcements of new Dimensity chipsets, smartphone manufacturers started teasing the arrival of Dimensity 8100 SoC-powered phones. Chinese smartphone manufacturers Realme, Redmi, Oppo, and OnePlus have announced the phone with the new Dimensity chip. Speaking of the device name, it will be the GT Neo3 from Realme, K50 Pro from Redmi, and OnePlus has not yet revealed the device name. 

These upcoming phones will be powered by Dimensity 8100 SoC

MediaTek Dimensity 8100 processor

The TSMC 5nm-based Dimensity 8100 SoC is MediaTek’s answer to Qualcomm’s Snapdragon 888 chipset. The new Dimensity chip has 1 x Cortex-X2 large core clocked at 3.05GHz, 3 x Cortex-A710 cores at 2.85GHz, and 4 x Cortex-A510 cores at 1.8GHz. The chip includes Arm Mali-G710 MC10 GPU. It supports up to 320MP primary camera, 4K video resolution, and camera features such as Video HDR, Video Bokeh, Video EIS, AI-HDR, and more.

The Dimensity 8100 chipset supports LPDDR5x RAM and UFS 3.1 storage. In terms of display, it can go up to 180Hz with FullHD+ resolution and 120Hz with WQHD resolution. Other notable specs include MediaTek 5th generation APU, 7Gbps download speed, 2.5Gbps upload speed, Wi-Fi 6, and Bluetooth v5.3 support.


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