Lenovo Legion is the company’s high-end gaming smartphone series. The latest member is the Legion 2 Pro (also known as Lenovo Legion Duel 2), which was launched earlier this year with Snapdragon 888 SoC. Now, Lenovo’s smartphone business General Manager has confirmed the arrival of the next Legion phone – Lenovo Legion 3 Pro. He also confirmed that the gaming phone will be powered by Qualcomm’s flagship 8450.
Qualcomm is yet to reveal the name of its next-generation flagship chip. However, rumors are rifle that it will be called Snapdragon 898. Lenovo’s GM in the Weibo post mentioned that the GPU in this new SoC (System-on-Chip) has been greatly improved.
The Qualcomm Snapdragon 898 (expected name) is said to be fabricated on Samsung’s 4nm process. The chip manufacturer has not yet revealed any details about its upcoming chipset. Rumors are that this new chip will offer 20% better performance as compared to Snapdragon 888. It seems the next-generation Qualcomm’s flagship SoC will bring a major boost to CPU as well as GPU performance.
Lenovo Legion 2 Pro has two active fans which allow the device to perform at its best without major heating issues. It seems, the company also implement active fans in Legion 3 Pro. Lenovo is also expected to bring several gaming optimizations too.
Last year, Qualcomm unveiled Snapdragon 888 SoC in December. And therefore, we speculate that the upcoming Snapdragon flagship SoC could be unveiled by the end of this year.
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