Apple’s new M1 Pro and M1 Max processors have already taken the world by storm in terms of its CPU as well as GPU performance. The M1s are at par with the latest Intel Alder Lake CPU and Nvidia RTX 3080 Mobile GPU while at the same time allowing for outstanding power efficiency.
However, Apple has no intention of slowing down. It has already started working on an even more powerful third generation of its chips even before revealing the second generation.
According to the reports by The information, the second generation of Apple chips, codenamed ‘Jade,’ will also be using a slightly upgraded 5-nanometer node for manufacturing. However, it will feature two CPU dies instead of one, which will outright double the number of CPU cores and CPU and GPU performance and will be used to power Apple’s upcoming desktop Macs.
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Other than these powerful dual die chips, Apple is also reportedly working on a single die chip codenamed ‘Staten,’ which will be used to power the long Rumored MacBook Air as well as Apple’s upcoming iPads.
But the most important thing revealed in the reports suggests that Apple’s third-generation chips codenamed ‘Ibiza,’ ‘Lobos’ and ‘Palma’ will be manufactured using TSMC’s 3-nanometer process, which is expected to hit the shelves as soon as 2023.
Apart from this, according to additional reports by Mark Gurman of Bloomberg, the most powerful apple chip would reportedly come with 40-cores. We also might see the first 3-nanometer chip in Apple’s upcoming iPhone 14.