Apple revealed its new M1 Max and M1 Pro Chips for the MacBook Pro back in October, and it hasn’t stopped amazing us since then. However, you might want to save some excitement for later, as Newly released pictures of the M1 Max reveal that its die might have an interconnect bus that could enable Multi-Chip-Module (MCM) scaling, which would theoretically allow the company to stack together multiple dies in a chiplet-based design, hinting towards how Apple’s future chip designs might look like.
We guess this might be true as these newer reports are in line with earlier reports that claimed the second generation of Apple chips, codenamed ‘Jade,’ would feature two CPU dies instead of one, packed together on a single chip using chiplet-based design.
If Apple goes forward with this chiplet based design, the M1 Max could theoretically be scaled into an “M1 Max Duo” or even an “M1 Max Ultra” configuration. This could quadruple the specs of the current M1 Max chips, which would result in a single chiplet with as high as 114 Billion transistors, equalling 40 CPU cores and 128 GPU cores combined with up to 256 GB of unified memory.
While on the other hand, a closer look at M1 Pro reveals that it lacks the so-called interconnect bus that is required to create the multi-die chiplet, which likely means that Apple wants to use the aforementioned chip design exclusively for its highest-end Mac Pro, which has not still been updated with an ARM processor.
Apart from the future chips, this also provides us with a closer look at Apple’s current lineup of chips which might already be using something similar to the interconnect bus to scale its M1 Pro chip into its famed M1 Max by connecting a separate chip module to the M1 Pro.
Overall, it seems like Apple has designed its most powerful chips ever with scalability and future-proofing in mind for at least a couple of years until Apple eventually switches to a 3-nanometer process. This would directly result in exceptional performance gains while saving tonnes of capital that would typically go towards R&D (Research and Development) to create a new chip design from scratch.
Are you as excited as we are for the next phase of Apple chips? Let us know in the comments below. Until then, stay tuned to Oyprice and subscribe to our YouTube channel. Also, follow us on Telegram, Facebook, and Twitter.